LED type utlizing lower power LED chips connected in series in parallel to eliminate the packaging of individual semiconductors. COB process reduces costs, weight and size. Chips can be mounted directly to lamp heat sinks, providing direct thermal dissipation. While not optimal for high intensity applications like street lights, COBs are ideal for filament style lamps.

Smaller version of the standard fluorescent light, more energy-efficient than incandescent bulbs.

LED chip encased in a hard plastic with 2 straight, parallel connecting pins. Epoxy covering focuses produced light. DIP chips were used in some of the earliest general illumination LEDs, though they suffer from inherent heat management problems.

Wide-beam, high-intensity light used to illuminate outdoor areas or large spaces.

Long, tubular lighting commonly used in commercial and industrial applications, known for its efficiency and low cost.

Type of incandescent lamp that uses a halogen gas to increase brightness and lifespan.

Category of lights including metal halide (MH), high-pressure sodium (HPS), and mercury vapor lamps, known for their high brightness and used for street and industrial lighting.

Traditional light bulb that produces light by heating a filament inside a glass bulb.

Highly energy-efficient light source that produces light through the movement of electrons in semiconductor materials.

LED style using multi-chip module technology to combine multiple integrated circuits(IC), semiconductor dies and other components into a singular substrate. Combined amalgamation can be used as a large IC, or divided into smaller "chiplets" the MCOBs can enable better transistor distribution. Great for low wattage situations.

LED chip utilizing surface mount technology. Electron hole components are mounted directly onto the board surface, enabling smaller structure and better heat dissipation. Without relying on an epoxy covering, SMDs can achieve a broader beam angle. Lower energy flow leads to reduced energy and longer technological lifetime.